The Union Cabinet has approved four semiconductor manufacturing units in Odisha, Punjab and Andhra Pradesh under the India Semiconductor Mission, at a cost of ₹4600 crore.
The Mission is gaining momentum as India advances into the compound semiconductor and advanced packaging sectors. These units will create jobs for skilled professionals by 2034 and boost the electronic manufacturing ecosystem, while generating many indirect jobs.
With the latest clearances, the total number of approved projects under ISM has reached ten. The Centre will invest ₹1.60 lakh crore across six states. On Tuesday, proposals from SiCSem, Continental Device India Private Limited, 3D Glass Solutions Inc., and Advanced System in Package Technologies were approved.
The new semiconductor units are a step towards the goal of Atmanirbhar Bharat, as demand for chips grows in automotive, telecom, data centers, consumer electronics, and industrial electronics.
ASIP will establish its manufacturing unit in Andhra Pradesh, in partnership with APACT Co Ltd from South Korea. It will produce 96 million units annually for use in mobile phones, set-top boxes, automobile systems, and other products.
